In the semiconductor industry additively manufactured spare parts for equipment are hardly used, as they go along with high characterization and qualification efforts for their use in the semiconductor manufacturing environment to ensure their and also the manufacturing reliability. Due to increasing delivery times and material requirements of spare parts as well as the availability of new technologies of 3D printing, IFAT decided to drive forward the additive manufacturing of spare parts in the context of iRel40.
MCL together with AT&S organized a WP3 workshop within the iRel40 project, all about “Advanced and functional materials and interfaces for enhanced reliability”. The workshop had the aim of reviewing and discussing all the achievements, the lessons learned, the challenges, and the future perspectives of the project.
This year the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems took place in Graz, Austria, between 16th and 19th of April 2023. The conference is fully in line with the development targets of the iRel40 project. More than 160 participants, one of the largest audience the conference ever had, discussed their latest results with special focus for impact on reliability improvement.
The internal stresses within microelectronic packages are influenced by package design, materials used, assembly processes, and environmental aging effects. In the iRel40 project, Sensitec and Infineon utilized the stress measurement chip in different packages to address distinct concerns.
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