Electronic Systems for offshore wind farms require reliable ECS.
iRel40 provides methodology and solutions along the value chain
from the wafer to the system.
Electronic Systems for offshore wind farms require reliable ECS.
iRel40 provides methodology and solutions along the value chain
from the wafer to the system.
Database generation and development of AI-methods
to understand customer use cases and improve
the reliability of next generation cooktops
Smart condition monitoring - Use of Artificial
Intelligence algorithms to identify critical parameters
with impact on reliability for automotive components
Smart condition monitoring - Use of Artificial
Intelligence algorithms to identify critical parameters
with impact on reliability for automotive components
Electronic lighting systems require long lifetime. Research in iRel40 will enable
lifetime prediction by smart sensing and data monitoring technologies. Target is to
develop an advanced technology to monitor on-line the degradation of the critical components.
The USE CASE will be the 1st RF MEMS operating up to the
Ka band capable of handling up to 30W.
Reduce the need for precautionary replacement
The main challenge is to develop a new generation
of RF MEMS capable of handling up to 30W power levels,
and > billions reliability cycles
Today’s trend is towards higher system integration driving increasing compactness and complexity and all at acceptable cost. Reliability is challenged on device and system level and faces exceptional requirements in respect to innovative applications. This requires customer acceptance but lead to their satisfaction. Reliability must be guaranteed, when using systems in new and critical environments (corrosive chemicals, extreme temperatures), whereby new materials must be used.
In iRel40 75 partners from 13 countries will collaborate along the value chain from wafer production to system integration and combine their strength to enhance reliability! The project is structured in 6 technical work packages. In WP1 specifications and requirements are studied. WP2 and WP3 will work out the basics on modelling, simulation, materials and interfaces based on test vehicles. In WP4 we apply the gained knowledge to industrial pilots with focus on volume production. In WP5 we apply the knowledge on industrial pilots related to testing.
In WP6 application use cases are manufactured and all project results are assessed and validated. This will allow us to develop reliable electronic components and systems faster. Developed processes can be transfered to production with high speed. Fundamental understanding by Physics of Failure and use of Artificial Intelligence methods will push overall quality levels and reliability specifically.
iRel40 results strengthen production along the value chain and support sustainable success of investment in microelectronic in Europe. Through close collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips pushing energy efficiency, e-mobility, autonomous driving, or IoT. This unique project brings, for the first time ever, world-leading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
The iRel40 consortium is proud to announce the publication of Recent Advances in Microelectronics Reliability, a valuable resource on exploring cutting-edge methodologies for the reliability analysis of microelectronics and semiconductors.
iRel40 partners organized a special issue at the 33rd European Safety and Reliability (ESREL) conference held at the University of Southampton, United Kingdom from 3-7 September 2023. ESREL is one of the most prominent conferences in safety and reliability, is an annual conference series run under the auspices of the European Safety and Reliability Association (ESRA). The conference dates to 1989, but it was not referred to as ESREL until 1992. The conference has become well established in the international community, attracting a good mix of academics and industry participants who present and discuss subjects of interest and application across various industries.
Techniques for prognostic and health management of electronic components typically rely either on physics-based or data-driven models. Within the iRel40 project, Sirris and Imec developed a framework to combine them via hybrid modelling and validated the methodology on a QFN package subject to die-delamination. The main results of this work are twofold. For diagnostics, the hybrid model can achieve better performance than the one obtained by the physics-based or data-driven models alone. For prognostics, the hybrid model can provide a precise forecast of the remaining useful life of the die.
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13
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