iRel40

iRel 40

intelligent Reliability 4.0

Electronic Systems for offshore wind farms require reliable ECS.
iRel40 provides methodology and solutions along the value chain
from the wafer to the system.

iRel 40

intelligent Reliability 4.0

Electronic Systems for offshore wind farms require reliable ECS.
iRel40 provides methodology and solutions along the value chain
from the wafer to the system.

© BSHE
© BSHE

iRel 40

intelligent Reliability 4.0

Database generation and development of AI-methods
to understand customer use cases and improve
the reliability of next generation cooktops

© Elaphe
© Elaphe

iRel 40

intelligent Reliability 4.0

Smart condition monitoring - Use of Artificial
Intelligence algorithms to identify critical parameters
with impact on reliability for automotive components

© Elaphe
© Elaphe

iRel 40

intelligent Reliability 4.0

Smart condition monitoring - Use of Artificial
Intelligence algorithms to identify critical parameters
with impact on reliability for automotive components

iRel 40

intelligent Reliability 4.0

Electronic lighting systems require long lifetime. Research in iRel40 will enable
lifetime prediction by smart sensing and data monitoring technologies. Target is to
develop an advanced technology to monitor on-line the degradation of the critical components.

iRel 40

intelligent Reliability 4.0

The USE CASE will be the 1st RF MEMS operating up to the
Ka band capable of handling up to 30W.
Reduce the need for precautionary replacement

iRel 40

intelligent Reliability 4.0

The main challenge is to develop a new generation
of RF MEMS capable of handling up to 30W power levels,
and > billions reliability cycles

"Intelligent Reliability 4.0 (iRel40)" has the ultimate goal of improving reliability of electronic components and systems by reducing failure rates along the entire value chain.

Today’s trend is towards higher system integration driving increasing compactness and complexity and all at acceptable cost. Reliability is challenged on device and system level and faces exceptional requirements in respect to innovative applications. This requires customer acceptance but lead to their satisfaction. Reliability must be guaranteed, when using systems in new and critical environments (corrosive chemicals, extreme temperatures), whereby new materials must be used.

In iRel40 75 partners from 13 countries will collaborate along the value chain from wafer production to system integration and combine their strength to enhance reliability! The project is structured in 6 technical work packages. In WP1 specifications and requirements are studied. WP2 and WP3 will work out the basics on modelling, simulation, materials and interfaces based on test vehicles. In WP4 we apply the gained knowledge to industrial pilots with focus on volume production. In WP5 we apply the knowledge on industrial pilots related to testing.

In WP6 application use cases are manufactured and all project results are assessed and validated. This will allow us to develop reliable electronic components and systems faster. Developed processes can be transfered to production with high speed. Fundamental understanding by Physics of Failure and use of Artificial Intelligence methods will push overall quality levels and reliability specifically.

iRel40 results strengthen production along the value chain and support sustainable success of investment in microelectronic in Europe. Through close collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips pushing energy efficiency, e-mobility, autonomous driving, or IoT. This unique project brings, for the first time ever, world-leading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.

News

Wire bonding breakage failure mechanism analysis in photodiode allowing for lifetime prediction

In the context of the iRel40 project, BSH Electrodomésticos España (BSHE) has studied the wire bonding breakage failure mechanism of a photodiode that integrates its induction cooktops, which is a consequence of applying strong thermal cycling. BSHE has performed an accelerated test consisting of the application of thermal cycling on the wire bonding/chip to test breakage, using the “Coffin-Manson equation” to determine the acceleration factor. The testing and a subsequent study of X-Ray spectroscopy and microscope filter images of the failed samples have allowed us to conclude that the failure is caused by the mismatch of coefficients of thermal expansion between the wire, the mold compound, and the silicon, causing a stress that the component is not capable to withstand. This conclusion has allowed BSHE to better define the factors that participate in the Coffin-Manson equation and thus be able to obtain a more accurate model for the estimation of the remaining useful life of this component. In addition, this has provided insights for the component’s supplier in order to develop a more robust and reliable component design and manufacturing process.

An all-digital hardware monitoring system at run-time to improve the reliability of electronic devices

This news describes a use case developed in the context of iRel40 (WP5 – T5.3.1) and presented at the ESREL 2023 conference. The main goal of such a use case is to show that it has been possible to exploit an all-digital hardware monitoring system at run-time to improve reliability with a focus on verification activities. For such a purpose, a pacemaker has been developed in two versions. One version has been based on a Commercial Off-The-Shelf microcontroller, where some properties have been verified by means of a classical offline traces analysis approach. The other version has been based on a soft-core Field Programmable Gate Array, where the same properties have been verified at run-time by means of the adopted all-digital hardware monitoring system. The comparison of the two verification approaches shows how it is possible (i) to reduce the time needed to perform verification and (ii) to provide the opportunity to verify more complex properties with respect to classical Built-In Self-Test approaches.

Project facts

 

Name: Intelligent Reliability 4.0
Duration: May 1st 2020 to April 30th 2023 (three years)
Total Costs: about 103,5 Mio Euro
Consortium: 75 partners from 13 nations
Coordinator: Infineon Technologies AG Germany

75

Partners

13

European Nations

103.5

Mio. € Total Costs