iRel40 - The EuroSimE developes to a hub for intelligent reliability
The conference covered eight significant iRel40 presentations, among them the Outstanding Poster Award contribution:
- “Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order model- ling approach” by Markus Weninger et This was a cooperation of AT&S Austria Technologie & Sys- temtechnik AG (Austria), Polymer Competence Center Leoben GmbH (Austria), and Prime Aerostructures GmbH (Austria);
- “Influence of the quality of material models on warpage and lifetime prediction by finite element simula- tion” by Julia Zündel et This was a contribution by iRel40 project partner AT&S Austria Technologie & Systemtechnik AG (Austria).
- “Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations” by Chinmay Nawghane, Bart Vandevelde (all IMEC), Thomas Moncond’huy, Pierre Vernhes, Rodolfo Cruz (all Insidix).
- “Ab-initio derived force field potential for accurate simulation of thermal transport in AlN” by Simon Fernbach, Elke Kraker, Natalia Bedoya-Martinez (Material Center Leoben, Austria);
- “Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading“, by Rudolf Kniely (ams OSRAM Group), Jens Heilmann (Chemnitz University of Technology), Fabian Huber (ams OSRAM Group), Bernhard Wunderle (Chemnitz University of Technology, Fraunhofer ENAS);
- “Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution, Infineon Technologies AG by Ser- gey Ananiev, M. Reuther, N. Del Vecchio, P. Altieri-Weimar (Infineon Technologies AG);
- "Strain Measurements and Thermo-Mechanical Simulation of SnAgCu low melting point alloy (LMPA- Q) solder joints", by Bart Vandevelde (IMEC Belgium) et al.
- In addition there was a iRel40 contribution during the Heterogeneous Integration Roadmap sessions. Ideas of the iRel40 project drive strongly the reliability section of Heterogeneous Integration Roadmap as shown in the contribution on “Reliability along the Value Chain – from Chip to Board/System” by Klaus Pressel, the iRel40 project leader.
All eight iRel40 presentations demonstrated excellent results on modeling and simulation generated in the project.
Authors of the new contribution:
Willem van Driel, Bart Vandevelde, Martin Niessner and Klaus Pressel