Robert Bosch Semiconductor Manufacturing Dresden GmbH
Bosch is building its 300mm semiconductor factory of the future in Dresden – in the heart of Silicon Saxony.
Robert Bosch Semiconductor Manufacturing Dresden GmbH (RBDD) is 100% subsidiary of Robert Bosch GmbH and part of the Automotive Electronics division of Bosch Mobility Solutions. In order to satisfy the demand generated by the growing number of internet of things and mobility applications, the company will manufacture chips on 300 mm wafers in a new semiconductor production site in Dresden.
This new high-tech plant will be the first of its kind; a 5G-ready digital building with specialized equipment for fabricating advanced power and mixed-signal semiconductor devices. Sales of the first chips will commence in mid-2022. Bosch is creating up to 700 jobs within this key enabling sector.
In iRel40, RBDD takes part in five main work packages. In WP1 (“Reliability Specifications and Requirements”), RBDD participates in two tasks. In WP4 (“Production & Development Excellence”), RBDD is work package co-leader participating also in two of the tasks. In WP5 (“Holistic Testing Assessment”), RBDD participates in two tasks, in one of them as task leader.
In WP6 (“Application Use Cases, Industrial Pilots Reliability validation and impact assessment”), RBDD coordinates, together with Infineon Technologies, the Industrial Pilot IP-14 (“Enhanced cross-site wafer-level reliability tests and methodology for reliability prediction”). RBDD also contributes, in WP7, to the dissemination, exploitation and standardization activities of the iRel40 consortium.
RBDD contributes to WP1 (“Reliability Specifications and Requirements”) by identifying key current and future reliability specifications and requirements of semiconductors for automotive applications and comparing them to the overall iRel40 target applications. In WP4 (“Production & Development Excellence”), RBDD develops a methodology for predictive analytics using Machine-Learning-based models and algorithms to examine the data of wafer-level-reliability (WLR) measurements of WP5 (“Holistic Testing Assessment”) and Industrial Pilot IP-14 in WP6.
In WP5, RBDD acquires and deploy WLR test platforms for migrating time-consuming monitoring tests from package-level to wafer-level aiming at speeding up time to root-cause analysis of reliability issues at product level. In Industrial Pilot IP-14, RBDD collaborates with IFX on enhanced cross-site wafer-level reliability tests and methodology for reliability prediction.