LEC GmbH develop electronic controllers for lasers. The areas of application are industry, laboratory applications and medical areas. Solutions: laser controllers and electronics for laser in the power range from 5mW up to more than 150W.
The company’s philosophy focused strongly to individual development and management of small laser series. With the experience of more than 25 years we provide solutions of laser controllers for laser devices in the range of 5mW up to more than 150W power. The current range remains within 50mA to 100A with pulse frequency up to 60kHz, TEC controller included as well as software for every operation. Separate Control boards and displays also available for every use.
The LEC GmbH supports partners from the start of the idea consequently up to the prototype and furthermore to the implementation of the product into the production process for series production. Manufacturing in highest quality is our passion.
LEC GmbH is a SME with the capability to develop application specific laser modules for demonstrators in cooperation with Infineon Dresden, Fraunhofer AZOM/IWS and WHZ. LEC is capable of performing enhanced developments towards products after the project which will ensure the industrial exploitation and relevance of research results. Main focus in the projects:
- Laser module and driver development
- Implementation Scaling of abrasive laser-systems
- Ultrafast Electronics and data acquisition development
The goal is to deliver an innovative laser-based solution to the fusion-repair of glass carrier wafers and the spatially controlled removal of auxiliaries such as adhesives. The key innovation is centered around the combination of multimodal monitoring devices (e.g. spatial-resolved thermal control, online transmission measurements) as well as laser fusion and selectively controlled thermal laser post-processing in order to minimize residual stresses.
Task 1 : Adaptive glass fusion-repair
In order to ensure the process of local melting of the surface of the wafer with minimal damage to the glass substrates a simulation of heat transport process will modelled. The application of a process related heat pretreatment and post-treatment will also be investigated and dimensioned. It is essential to design a process which accounts for the initial material properties in correspondence the desired optical transmission. During the simulation phase LEC with it’s partners will develop a model to account for these requirements for the final approach. Thereby LEC will focus on the development of an appropriate driver/control system for the laser(s) in conjunction with the spatially-resolving temperature monitoring approach. Its significant to qualify the technology for a possible later application in wafer manufacturing.
Task 2 : Selective adhesive cleaning
The second task of this objective is centered on the selective cleaning of organic auxiliaries such as adhesives. During mounting, the adhesive material protrudes under the silicon wafer partially. On the basis of the gathered results, IFD, LEC and FTZ will design and model a laser-based process to manipulate the adhesive in order to minimize the scatter and eliminate alignment errors.
Here, LEC will design an appropriate driver and laser module based on the previous results which will allow a precise manipulation of adhesives while keeping thermal influences and stresses on the necessary adhesive, the Si-wafer and the glass wafer at a minimum. Furthermore it will be ensured that the adhesive still covers the complete backside of the Si-wafer in order to prevent bending stress and possible points of breakage.
The challenge consists of the precise manipulation of adhesives In addition to the driver/laser design, By usage of the simulation results, LEC and IWS-AZOM will going to build a laboratory scale setup to perform glass fusion repair based on a CO2 laser. The partners will set up a demonstrator to proof the effectiveness of the approach under real conditions. For this purpose, it is planned to develop a compact entity with an ablation and monitoring system which can be easily integrated into the manufacturing line for final evaluation. The evaluation focuses on the speed and quality of the ablation as well as on the notch alignment results with regard to the decrease of misalignments.