JIACO Instruments artifact-free decapsulation with atmospheric plasma enables accurate and reliable physical failure analysis and product quality control of semiconductor devices using Oxygen & patent-pending Hydrogen based plasma decapsulation recipes.
JIACO Instruments atmospheric Microwave Induced Plasma (MIP) decapsulation is the new standard for Failure Analysis & Reliability Testing. The fully automated process is highly selective, utilizing only Oxygen and patent-pending Hydrogen-based recipes. Critical failure sites in advanced packages e.g. SiP, 2.5D, 3D are retained without process-induced damage to challenging materials e.g. Ag, Cu bond wire, GaAs, Cu μbump, BOAC. The MIP decapsulation system thus enables true root cause failure analysis and is also invaluable during qualification procedures for new processes and materials.
The JIACO Instruments system has been in the market since mid-2016 and is now in use by many renown global companies to solve their most complex decapsulation challenges in Failure Analysis & Reliability Testing.
JIACO Instruments will provide advanced plasma decapsulation tools and processes to enable the exposure and preservation of original failures sites to facilitate true root cause physical failure analysis on devices after reliability tests. JIACO Instruments’ technology supports partners in degradation detection on devices after reliability test for early symptom analysis.
Within the iRel4.0 project, JIACO Instruments will develop sample preparation tools and techniques to expose and preserve original failure sites for root cause analysis. The results will enable partners to perform accurate failure analysis on degraded or failed devices after reliability tests. Improvements will be implemented in current tools and techniques in JIACO Instruments, and new processes will be developed, to benefit the semiconductor industry by providing better equipment that enables more reliable electronics.