Infineon Technologies AG
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security.
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, mobility, and security.
Infineon is the No. 2 chip supplier to the automotive industry. Their sustained success in automotive electronics is attributed to a consistent focus on automotive applications and their requirements, a profound understanding of the automotive system based on 40 years of experience and a broad innovative product portfolio of outstanding quality.
The Automotive Division of Infineon supplies the automotive industry with sensors, microcontrollers and power semiconductors that contribute to a more sustainable mobility in terms of reduced fuel consumption/emissions, improved safety and affordability.
Role
Infineon Technologies AG is the overall coordinator of the publically funded iREl40 project. In addition Infineon contributes to the innovative and technical progress of the project. Infineon as a major supplier of semiconductor systems and components will participate with activities on transport, digitization of its development and manufacturing processes.
Key contribution
Main tasks in the project:
- Infineon (IFAG) contribute to iRel40 with its silicon frontend and backend (assembly and packaging, A&P) process development and factory integration. Teams all along the value chain from chip technology, package technology and module technology are involved including modelling and simulation.
- Infineon participates in all work packages WP1 to WP8. Infineon is responsible for three use cases in the iREl40 project and will collaborate and supportat least further 5 use cases.
- IFAG will focus on the following topics:
- Set-up and demonstrate improvement of reliability for targeted pilot lines/production (industrial pilots) for IFAG Regensburg FE applied to smart power devices;
- Set-up and demonstrate improvement of reliability for targeted assembly and packaging pilot lines (industrial pilots) at IFAG Regensburg for A&P e.g. of pressure sensors and system-in-package solutions
- Set-up and demonstrate improvement of reliability for targeted module/system pilot lines (industrial pilots) at IFAG Warstein
- Investigate and demonstrate that artificial intelligence and Industry4.0 technologies will improve semiconductor, packaging and board/system manufacturing in respect to reliability. Infineon will work on advanced automation and metrology to improve its innovative assembly and packaging technologies.
Infineon Technologies AG
Am Campeon 1-12
85579 Neubiberg
Germany
www.infineon.com