Anselmo Martínez; Lidia M. Belmonte; Arturo S. García; Antonio Fernández-Caballero; Rafael Morales

Facial Emotion Recognition from an Unmanned Flying Social Robot for Home Care of Dependent People

Electronics (2021): 10(7), 868

Belmonte, L.M.; Segura, E.; Fernández-Caballero, A.; Somolinos, J.A.; Morales, R.

Generalised Proportional Integral Control for Magnetic Levitation Systems Using a Tangent Linearisation Approach

Mathematics (2021): 9(12), 1424

F. Emadi; V. Vuorinen; G. Ross; M. Paulasto-Kröckelk

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

Materials Science and Engineering: A (2023): 881, 145398

Jakob Willner, Lukas Brunnbauer, C. Derrick Quarles, Jr., Michael Nelhiebel, Silvia Larisegger, Andreas Limbeck

Development of a simultaneous LA-ICP-MS & LIBS method for the investigation of polymer degradation

The Royal Society of Chemistry (2023): 38, 2028-2037

M. Millesimo, M. Borga, L. Valentini, B. Bakeroot, N. Posthuma, A. Vohra, S. Decoutere, C. Fiegna, A. N. Tallarico  

Role of the GaN-on-Si Epi-Stack on ∆RON Caused by Back-Gating Stress

IEEE Transactions on Electron Devices (2023): 5203 - 5209

SUMIRAN MEHRA, GOPAL RAUT, RIBHU DAS, SANTOSH KUMAR VISHVAKARMA, ANTON BIASIZZO

An Empirical Evaluation of Enhanced Performance Softmax Function in Deep Learning

IEEE Access (2023): 34912 - 34924

Jiarui Mo, Jinglin Li, Yaqian Zhang, Alexander May, Tobias Erlbacher, Guoqi Zhang, Sten Vollebregt

A Highly Linear Temperature Sensor Operating up to 600◦C in a 4H-SiC CMOS Technology

IEEE Electron Device Letters (2023): 995 - 998

Lukas Brunnbauer, Veronika Zeller, Zuzana Gajarska, Silvia Larisegger, Stefan Schwab, Hans Lohningner, Andreas Limbekck

Classification of epoxy molding compounds by Tandem LA-ICP-MS/LIBS to enhance the reliability of electronic devices

Spectrochimica Acta Part B (2023): 207, 106739

Jakob Willner, Lukas Brunnbauer, Silvia Larisegger, Michael Nelhiebel, Martina Marchetti-Deschmann, Andreas Limbeck

A versatile approach for the preparation of matrix-matched standards for LA-ICP-MS analysis - Standard addition by the spraying of liquid standards

Talanta (2023):  256, 124305

Francisco López de la Rosa, José L. Gómez-Sirvent, Rafael Morales,Roberto Sánchez-Reolid, Antonio Fernández-Caballero

Defect detection and classification on semiconductor wafers using two-stage geometric transformation-based data augmentation and SqueezeNet lightweight convolutional neural network

Computers and Industrial Engineering (2023): 109549

By Yun Chen, Luis Carlos Castro Heredia, Johan J. Smit, Mohamad Ghaffarian Niasar, Robert Ross

Giant magneto-resistive (GMR) sensors for non-contacting partial discharge detection

IEEE Transactions on Instrumentation and Measurement (2023): 6004411

Martin Kemeny, Peter Ondrejka, Miroslav Mikolasek

Comprehensive degradation analysis of NCA Li-ion batteries via methods of electrochemical characterization for various stress-inducing scenarios

Batteries (2023): 9(1), 33

M. Millesimo, M. Borga, B. Bakeroot, N. Posthuma, S. Decoutere, E. Sangiorgi, Life Fellow, IEEE, C. Fiegna, A. N. Tallarico

The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs

IEEE Journal of Electron Device Letters (2022): 1846 - 1849

F. Bonet, O. Aviñó-Salvad ó, M. Vellvhi, X. Jorda, P. Godignon, X. Perpiñà.

Carrier Concentration Profile in 1.2 kV SiC Schottky diodes under Current Crowding

IEEE Journal of Electron Device Letters (2022): 938 - 941

Joshua Lommesa, Gesa Patzelta, Volkmar Stenzel

UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips

Microelectronic Engineering (2023): 277, 112014

O. Aviñó-Salvadó, C. Buttay, F. Bonet, C. Raynaud, P. Bevilacqua, J. Rebollo, H. Morel, X. Perpiñà

Physics-based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETsGeometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

IEEE Transactions on Industrial Electronics (2023): 1-10

de la Rosa, Francisco López, José L. Gómez-Sirvent, Roberto Sánchez-Reolid, Rafael Morales, and Antonio Fernández-Caballero.

Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a ResNet50 convolutional neural network

Expert Systems with Applications (2022): 117731.

Hagara, Miroslav, Radovan Stojanović, Alexander Šatka, Peter Kubinec, and Oldřich Ondráček.

Modified algorithm of unimodal thresholding for FPGA implementation

Microprocessors and Microsystems 94 (2022): 104669.

López de la Rosa, Francisco, Roberto Sánchez-Reolid, José L. Gómez-Sirvent, Rafael Morales, and Antonio Fernández-Caballero.

A review on machine and deep learning for semiconductor defect classification in scanning electron microscope images

Applied Sciences 11, no. 20 (2021): 9508.

Modolo, N., C. De Santi, G. Baratella, A. Bettini, M. Borga, N. Posthuma, B. Bakeroot et al.

Compact Modeling of Nonideal Trapping/Detrapping Processes in GaN Power Devices

IEEE Transactions on Electron Devices 69, no. 8 (2022): 4432-4437.

de la Rosa, Francisco López, José L. Gómez-Sirvent, Rafael Morales, Roberto Sánchez-Reolid, and Antonio Fernández-Caballero.

A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets

Applied Soft Computing (2022): 109743.

Millesimo, M., C. Fiegna, N. Posthuma, M. Borga, B. Bakeroot, S. Decoutere, and A. N. Tallarico

High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs

IEEE Transactions on Electron Devices 68, no. 11 (2021): 5701-5706

Olschewski, Thomas.

Fast Accurate Defect Detection in Wafer Fabrication

arXiv preprint arXiv:2108.11757 (2021)

Olschewski, Thomas

Defect Detection on Semiconductor Wafers by Distribution Analysis

arXiv preprint arXiv:2111.03727 (2021)

Safari, Leila, Gianluca Barile, Vincenzo Stornelli, Shahram Minaei, and Giuseppe Ferri

Towards Realization of a Low-Voltage Class-AB VCII with High Current Drive Capability

Electronics 10, no. 18 (2021): 2303

Van Driel, Willem D., B. Jacobs, P. Watte, and X. Zhao

Reliability of LED-based systems

Microelectronics Reliability 129 (2022): 114477

Tallarico, A. N., M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, and C. Fiegna

TCAD Modeling of the Dynamic V TH Hysteresis Under Fast Sweeping Characterization in p-GaN Gate HEMTs

IEEE Transactions on Electron Devices 69, no. 2 (2021): 507-513

Meneghini, Matteo, Carlo De Santi, Idriss Abid, Matteo Buffolo, Marcello Cioni, Riyaz Abdul Khadar, Luca Nela et al

GaN-based power devices: Physics, reliability, and perspectives

Journal of Applied Physics 130, no. 18 (2021): 181101

Bonet, F., O. Aviñó-Salvadó, M. Vellvehi, X. Jordà, P. Godignon, and X. Perpiñà

Carrier Concentration Analysis in 1.2 kV SiC Schottky Diodes under Current Crowding

IEEE Electron Device Letters (2022) (Early Access)

Book chapter:

van Driel, W. D., B. J. C. Jacobs, G. Onushkin, P. Watte, X. Zhao, and J. Lynn Davis

Reliability and Failures in Solid State Lighting Systems

In Reliability of Organic Compounds in Microelectronics and Optoelectronics, pp. 211-240. Springer, 2022.

Book chapter:

van Driel, W. D., M. Yazdan Mehr, X. J. Fan, and G. Q. Zhang

Outlook: From Physics of Failure to Physics of Degradation

In Reliability of Organic Compounds in Microelectronics and Optoelectronics, pp. 535-538. Springer, 2022.