Conference Contributions

Baraldi, S. Medici, I. Ahmed, E. Zio, H. Lewitschnig

A Method Based on Gaussian Process Regression for Modelling Burn-in of Semiconductor Devices

31st European Safety and Reliability Conference

19-23.09.2021, Angers, France (hybrid event)

P. Sanaa, A. Graffa, S. Hübnera, M. Simone-Najaseka, V. Zhan Gaob, F. Rampazzob, B. Lambertc, G. Meneghessob, E. Zanonib, M. Meneghinib and F. Altmanna

Microstructural Degradation Investigations of OFF-State Stressed 0.15 µm RF AlGaN/GaN HEMTs: Failure Mode related Breakdown

WiPDA, the IEEE Wide Bandgap Power Devices and Applications workshop

November 7-9, 2021, Redondo Beach, California

K. Pressel, J. Moser, S. Rzepka, K. Brinkfeldt, S. Zhao, W. van Driel, P. Giammatteo, B. Bulut, Soyturk, L. Pomante

The H2020-ECSEL Project” iRel40” (Intelligent Reliability 4.0)

DSD 2021

September 1-3, 2021, Palermo, Italy

L. Hahne, F.A. Velarde G., A. Lange, Chr. Sohrmann, D. Wetzel, S. Crocoll

ReliaVision: In-circuit transistor reliability investigation using XML-based technology reliability information in PDKs

IEEE International Integrated Reliability Workshop (IIRW)

October 2021, (online)

W.D. Van Driel, B.J.C. Jacobs, P. Watte, X. Zhao,

Reliability of LED-based Systems

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

6-27.07.2020 (online event)

P. Watté, G. van Hees, R. Engelen, W.D van Driel

Reliability of electronic drivers: An industrial approach

ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems,
InterPACK2021

October 26-28, 2021, (online)

M. Hashemi, M. A. Golkani, D. Watzenig

A Robust Approach for Inter-Turn Fault Detection of PMSM Used for Autonomous Vehicles

International Conference on Connected Vehicles and Expo

February 21-23, 2022, Florida, USA

J. Marek, J. Kozárik, A. Chvála, M. Minárik, M.Donoval

Power SIC MOSFET Under Repetitive UIS and Short Circuit Stress

Advances in Electronic and Photonic Technologies (ADEPT 2021)

20-23.09.2021, Podbanské, Slovakia

S. Grubmueller, P. Innerwinkler

A Framework for the Determination of realistic Usage Profiles for Automated Shuttle Pods

IEEE International Conference on Connected Vehicles and Expo 2022

March 7-9, 2022, Florida, USA

J. Zündel, M. Sagerer, M. Frewein, T. Krivec

Characterization of prepreg shrinkage and investigation of its influence on warpage simulation

EuroSimE Conference 2021

July 6 - 8, 2021,  (online)

M. Frewein, S. Stojanovic, Q. Tao, T. Krivec, J. Zuendel, M. Goessler, P. F. Fuchs, M. Gschwandl

An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

EuroSimE Conference 2022

April 24 - 27, 2022, Malta

F. Chiocchetta, C. De Santi, F. Rampazzo, K. Mukherjee, Jan Grünenpütt, Daniel Sommer, Hervé Blanck, Benoit Lambert, G. Meneghesso, E. Zanoni, and M. Meneghini

GaN RF HEMT Reliability: Impact of Device Processing on I-V Curve Stability and Current Collapse

International Reliability Physics Symposium 2022

March 27-31, 2022, Dallas, Texas

M. Millesimo, B. Bakeroot, M. Borga, N. Posthuma, S. Decoutere, E. Sangiorgi, C. Fiegna, and A. N. Tallarico

Gate Reliability of p-GaN Power HEMTs Under Pulsed Stress Condition

2022 IEEE International Reliability Physics Symposium (IRPS)

March 27-31, 2022, Dallas, TX, USA

T. Krivec

Virtual Assessement of Power Packages

8th European Expert Workshop on Reliability of Electronics and Smart Systems

October 22, 2020, (online)

D. Kostynski, S. Sack, M. Sievers

Active Thermal Cycling of Discrete Power Semiconductors for Applications with strong ∆T-Profiles

12th International Conference on Integrated Power Electronics Systems

March 18-20, 2022, Berlin, Germany

B.S.Çağlar, H.B.Ketmen, B. Bulut

Anomaly Detection using Audio Signals

International Aegean Scientific Research Symposium 2021

December 25-26, 2021, (online)

T.Happonen, A.Korhonen, P.Järvinen, M.Turunen, T. Liimatta, M. Paakkolanvaara, and T.Alajoki

Roll-to-roll manufacturing and reliability assessment of stretchable temperature sensors

LOPEC 2022

March 23–24, 2022, München, Germany

R. Dudek, R. Döring, A. Mathew, A. Otto, S. Rzepka

Modelling Thermal Fatigue in Power Electronics

EuroSimE 2022

April 25 – 27, 2022, Malta

T. Krivec

Virtual warpage analysis as major tool for “Design for Reliability” for PCBs and IC-substrates

Integrated Computational Materials, Process and Product Engineering - IC-MPPE 2022

May 6, 2022, Leoben, Austria