In a first step, IFAT performed a literature research and analysis for common used 3D printing technologies for plastics, ceramics and metals, considering their usability for spare parts in semiconductor manufacturing. After the general feasibility for additive manufactured spare parts for the semiconductor manufacturing was proven, parts were evaluated regarding their additive manufacturability. Selected spare parts were redesigned according to the production requirements to improve their reliability with a simulation software. After fabrication, the spare parts were characterized to check if they achieve the needed cleanroom requirements and do not have any effect on semiconductor components in the production process. Moreover, some of the spare parts in focus of this project where already qualified according to the standard qualification procedures for cleanroom implementation. The qualification step is a key process to ensure that semiconductor manufacturing does not experience reliability issues due to cross-contamination caused by abrasion. The within the iRel40 project fabricated and qualified spare parts are already in use in the Villach semiconductor fab, thereby enhancing also the reliability of the semiconductor manufacturing processes.

Redesigned and additive manufactured wafer holder bracket

The overall goal of IFAT is to build up skills in the context of 3D printing to further manufacture reliable spare parts in-house. Thereby, taking into consideration the following advantages of 3D-printed spare parts:

• Optimize the design and/or used material of the parts to increase their robustness and/or efficiency,
• more flexibility in terms of material requirements and functionalities,
• shorter “delivery times”,
• reduction of inventory and material use,
• gain knowledge in the context of additive manufacturing at IFAT to produce reliable spare parts in-house and
• set up a 3D printing competence center for Infineon in the long term.