iRel40 General Assembly in Istanbul
The first face-to-face General Assembly meeting of the ECSEL JU project iRel40 took place from Monday, May 16th to Thursday, May 19th 2022 in Istanbul. The meeting started with a Come Together Networking on Monday 16th late afternoon at the meeting hotel in the east of Istanbul.
Figure 1: Lively discussion during the networking event with key players in the field.
Figure 2: 95 participants joined the meeting onsite. During the General Assembly, the status of the iRel40 project was summarized.
Figure 3: iRel40 core team during the General Assembly meeting (left). Klaus Pressel, Infineon’s iRel40 project leader, congratulating the local organizer Prof. Mujdat Soyturk (Marmara University) for an outstanding General Assembly Week.
During the four days event, all technical work packages organized workshops, which were also available online for project partners who could not attend the meeting in person. Workpackage WP2 organized a workshop on Artificial Intelligence. WP3 focused on sharing experimental results on new material characterization and interfaces. In WP4 a lively workshop with quick bilateral exchange took place. In WP4 a lively iRel40 speed dating workshop was organized where the partners introduced themselves for 1.5 minutes and for another 1.5 minutes they introduced their work in iRel40. Workpackage WP5 was organized in addition to presentations also poster presentations to catalyze scientific exchange.
Figure 4: Partners introducing their research related to use cases during the WP2 session (left); in WP4 a lively iRel40 speed dating took place (right).
Workpackage 6 includes research and development on the 34 use cases improving reliability. This includes 16 application-driven use cases from the three domains Digital Industry, Energy, and Transport. In addition, the consortium works on 18 so-called industrial pilots which focus on improvement of reliability in production and testing.
The status of the use cases was introduced by short highlight presentations. This session was followed by a poster session including all the 34 use cases together with eight special technical posters.
Figure 5: The iRel40 team during the use case highlight presentations (left). The WP6 poster session was used for extensive discussions between work packages (right).
iRel40 is a project that considers the value chain from wafer to chip to package/module to board/system application. This includes building bridges between these different domains. This was also a focus topic during a social event, which included a laser show with the iRel40 logo on the Bosporus bridge connecting Europe and Asia.
Figure 6: Photo of the iRel40 laser image on the Bosporus bridge (left); also during the boat trip partners discussed the important topics of reliability (right).
The iRel40 event in Istanbul was connected with two dissemination and exploitation events:
- There was a visit of an iRel40 project core team at Technopark Istanbul on Monday, May 16th
To make the iRel40 F2F Istanbul Meetings more efficient and productive, the additional bilateral and/or group meetings with the industrial organizations, mainly located at Teknopark Istanbul, the biggest technology development zone in Turkey, have been set-up (video of Teknopark Istanbul).
Figure 7: Introduction of iRel40 by partners (left); lively bilateral meetings between participants on research and development opportunities (right).
- There was a visit to a Marmara University and its VeNIT Lab on Friday, May 20th
Figure 8: Close to twenty iRel40 colleagues visited Marmara University and its Vehicular Networking and Intelligent Transportation Systems Research Lab (left). Researchers from Venit research lab introduced the iRel40 partners to their research (right).