Aalto University is a multidisciplinary community of bold thinkers where science and art meet technology and business. We are committed to identifying and solving grand societal challenges and building an innovative future. Aalto University has six schools with nearly 11 000 students and more than 400 professors. Our campuses are located in Espoo and Helsinki, Finland.
Aalto University was founded in 2010, when Helsinki University of Technology, the Helsinki School of Economics and the University of Art and Design Helsinki were merged. We educate game changers to solve grand challenges and create wellbeing in society. This requires disciplinary excellence combining creativity, collaboration and entrepreneurship. We also offer open university instruction as well as leadership development services.
Electronics Integration and Reliability is a research group at Aalto University School of Electrical Engineering studying advanced materials and bonding technologies to realize ubiquitous sensor/actuator and high temperature capable power electronics systems. The group is using the world-class facilities of OtaNano, which is the national research and development center for micro- and nanotechnology jointly managed by Aalto University and VTT Technical Research Centre of Finland.
The capabilities of Electronics Integration and Reliability group of Aalto University will be instrumental to clarify failure mechanisms in interconnections of 3D integrated, wafer bonded modules. Specifically, Aalto aims to demonstrate Sn-Cu-In based low temperature solid-liquid interdiffusion bonding for high reliability applications. Aalto will also assist its partners to improve the ppm level problem detection capabilities by providing theoretical and experimental analysis for better understanding of reliability issues at different interfaces. Aalto University will participate in the Industrial Pilot IP12 and the tasks 3.1.1, 3.1.2 and 3.3.1.
Aalto University will:
- investigate the impact of aging and process induced thermo-mechanical stresses in small volume SLID (solid-liquid interdiffusion) interconnections with thin wafer stacks and vertical vias.
- demonstrate high reliability low stress bonding technology potential for automotive power applications.
- develop methods to identify early degradation in metal µBumps and control the impact of impurities and micro-defects.